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Shenzhen Zhangdao Electronics Co., Ltd.
Shenzhen Zhangdao Electronics Co., Ltd. The customer to be supreme, the quality first
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4 OZ Hi Tg FR-4 pcb prototype printed circuit Min Annular Ring Peelable PCB

4 OZ Hi Tg FR-4 pcb prototype printed circuit Min Annular Ring Peelable PCB

Place of Origin : Shenzhen
Brand Name : Zhangdao
Certification : SGS,ROHS,UL
MOQ : Negotiable
Price : Negotiable
Packaging Details : Standard Packing
Delivery Time : 5-8 days
Payment Terms : L/C,T/T,Western Union
Supply Ability : 600 Square Meter/Square Meters per Day
Contact Now

4 OZ Hi Tg FR-4 pcb prototype printed circuit Min Annular Ring Peelable PCB boards


1,A factory-directed price
2,One-stop service
3,High quality guaranteed
4,Experienced support


Electronic PCB,pcb design,copy of PCB,PCB board,PCB layout,circuit board,electronic board,electronic circuit,


Pls contact us for more informations if you have any interests in our products.

Our PCB board manufacture and PCBA service

* PCB board file with parts list provided by customers

* PCB board made, circuit board parts purchased by us

* PCB board with parts assembled

* Electronic testing circuit board or PCBA

* Fast delivery, anti-static package

* RoHS Directive-compliant, lead-free

* One stop service for PCB design, PCB layout, PCB manufacture, components purchasing,

PCB assembly, test, packing and PCB delivery


PCB Capability



Specification Inch (mm)

Material

FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium /Rogers/Teflon/PTFE/Taconic

Layer No.

1-30

Board thickness

0.0075"(0.2mm)-0.125"(3.2mm)

Board Thickness Tolerance

±10%

Cooper thickness

1/2OZ-4OZ

Impedance Control

±10%

Warpage

0.075%-1.5%

Peelable

0.012"(0.3mm)-0.02’(0.5mm)

Min Trace Width (a)

0.005"(0.125mm)

Min Space Width (b)

0.005"(0.125mm)

Min Annular Ring

0.005"(0.125mm)

SMD Pitch (a)

0.012"(0.3mm)

pcb with green solder mask and LF-FREE surface finishingBGA Pitch (b)

0.027"(0.675mm)

Regesiter torlerance

0.05mm

Min Solder Mask Dam (a)

0.005"(0.125mm)

Soldermask Clearance (b)

0.005"(0.125mm)

Min SMT Pad spacing (c)

0.004"(0.1mm)

Solder Mask Thickness

0.0007"(0.018mm)

Hole size

0.01"(0.25mm)-- 0.257"(6.5mm)

Hole Size Tol (+/-)

±0.003"(±0.0762mm)

Aspect Ratio

6:1

Hole Registration

0.004"(0.1mm)

Plating

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel 3-7um Au:1-3u''

OSP

0.2-0.5um

Outline

Panel Outline Tol (+/-)

±0.004''(±0.1mm)

Beveling

30°45°

V-cut

15° 30° 45° 60°

Certificate

ROHS ISO9001:2000 TS16949 SGS UL



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